Silicon wafer foundry service providers have been useful to the semiconductor industry and the sectors it serves. The advanced technology it offers, particularly with the advent of fabless business model, provides the affordability advantage, which is essential to maintaining minimal production costs of the their processes. Through foundry service providers' process capabilities, the production of semiconductor components such as MEMS have been efficient and cost-effective in the recent years.
What are these process capabilities? Check out the following:
Lithography - an industry process that is carried out by putting specific patterns on silicon substrates. These patterns are written using a light sensitive polymer called photoresist. Also called photolithography, this process takes a crucial part in the production of semiconductor elements that is integrated to millions of transistors.
Etching - in simpler terms, it is a process of making prints on the surface of the substrate or wafer. Several wafer foundry companies have a broad range of wet etching capability for 300mm and smaller diameters, for a broad range of dielectrics and metal films. They can also process non-standard sized substrates.
Wafer reclaim and recovery - with this capability, a wafer foundry company mechanically re-polishes wafers to remove surface scratches and residual patterns on the surface of the substrates. This process is meant to extend the life of a substrate for a longer use. This process is a solution to costumers who aim at lowering their production costs.
Thin films (dielectrics) - foundry companies utilize equipment such as custom furnaces to carry out processes like thermal oxide and LPCVD processes.
KISS Polishing - this process is utilized by foundry companies for the removal of minor surface scratches or defects on a substrate; this process involves visual inspection to find wafers with chips and cracks.
There are still several process capabilities used inside a silicon wafer foundry service facility - thanks to the people behind these innovations. True indeed that they play a crucial role to the semiconductor industry and the sectors it serves.
What are these process capabilities? Check out the following:
Lithography - an industry process that is carried out by putting specific patterns on silicon substrates. These patterns are written using a light sensitive polymer called photoresist. Also called photolithography, this process takes a crucial part in the production of semiconductor elements that is integrated to millions of transistors.
Etching - in simpler terms, it is a process of making prints on the surface of the substrate or wafer. Several wafer foundry companies have a broad range of wet etching capability for 300mm and smaller diameters, for a broad range of dielectrics and metal films. They can also process non-standard sized substrates.
Wafer reclaim and recovery - with this capability, a wafer foundry company mechanically re-polishes wafers to remove surface scratches and residual patterns on the surface of the substrates. This process is meant to extend the life of a substrate for a longer use. This process is a solution to costumers who aim at lowering their production costs.
Thin films (dielectrics) - foundry companies utilize equipment such as custom furnaces to carry out processes like thermal oxide and LPCVD processes.
KISS Polishing - this process is utilized by foundry companies for the removal of minor surface scratches or defects on a substrate; this process involves visual inspection to find wafers with chips and cracks.
There are still several process capabilities used inside a silicon wafer foundry service facility - thanks to the people behind these innovations. True indeed that they play a crucial role to the semiconductor industry and the sectors it serves.
About the Author:
Paul Drake writes a wide array of high tech topics and he uses his work experience in a high tech company in his writing tasks. To know more about thermal oxide and other foundry services, visit Noel Tech Official Website.
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